๋ฐ˜์‘ํ˜•

๋จธ์‹  ๋น„์ „์—์„œ 3D ์Šค์บ”์„ ์œ„ํ•œ ๋ฐฉ๋ฒ•์œผ๋กœ๋Š” ๊ณต์ดˆ์ (Confocal), ๊ตฌ์กฐ๊ด‘(Structured Light), ๊ด‘ ์‚ผ๊ฐ๋ฒ•(Triangulation Method) ๋“ฑ์ด ์žˆ์Šต๋‹ˆ๋‹ค. ์ด ์ค‘์—์„œ๋„ ๊ด‘ ์‚ผ๊ฐ๋ฒ•์ด ๋Œ€ํ‘œ์ ์œผ๋กœ ๋งŽ์ด ์‚ฌ์šฉ๋ฉ๋‹ˆ๋‹ค. ๋น„๊ต์  ์‰ฌ์šด ๊ตฌ์„ฑ๊ณผ ํ•ฉ๋ฆฌ์ ์ธ ๊ฐ€๊ฒฉ, ๊ทธ๋ฆฌ๊ณ  ๋ฐ์ดํ„ฐ๋ฅผ ๊ฐ„๋‹จํžˆ ์–ป์„ ์ˆ˜ ์žˆ๊ธฐ ๋•Œ๋ฌธ์ž…๋‹ˆ๋‹ค. ๋ฌผ๋ก  ๋น„๊ต์  ์‰ฝ๋‹ค๋Š” ๊ฒƒ์ด์ง€ ๊ด‘์‚ผ๊ฐ๋ฒ•์ด ์‰ฝ๋‹ค๋Š” ๊ฒƒ์€ ์•„๋‹™๋‹ˆ๋‹ค.

์ด๋ฒˆ ํฌ์ŠคํŒ…์—์„œ๋Š” ๊ด‘์‚ผ๊ฐ๋ฒ•์ด ์‚ฌ์šฉ๋˜๋Š” ์–ดํ”Œ๋ฆฌ์ผ€์ด์…˜์„ ์†Œ๊ฐœํ•˜๋ ค๊ณ  ํ•ฉ๋‹ˆ๋‹ค.

์„ ๋กœ ๊ฒ€์‚ฌ(Railway inpection)

๋ ˆ์ด์ €๋กœ ์„ ๋กœ๋ฅผ ์Šค์บ”ํ•˜์—ฌ ๊ฒฐํ•จ์ด ์—†๋Š”์ง€ ๊ฒ€์‚ฌํ•˜๋Š” ์–ดํ”Œ๋ฆฌ์ผ€์ด์…˜์ž…๋‹ˆ๋‹ค. ์•„๋ž˜ ๋™์˜์ƒ์€ ์„ ๋กœ๋งŒ ๊ฒ€์‚ฌํ•˜์ง€๋งŒ, ์—ด์ฐจ์˜ ์™ธ๊ด€ ๊ฒ€์‚ฌ์—๋„ ์‚ฌ์šฉ๋˜๋Š” ์ œํ’ˆ๋„ ์žˆ์Šต๋‹ˆ๋‹ค.

<์ถœ์ฒ˜: graw>

์™ธํ˜• ๊ฒ€์‚ฌ(Object inspection)

์ œํ’ˆ์˜ ์™ธํ˜•์„ ์Šค์บ”ํ•˜์—ฌ ์น˜์ˆ˜, ๋†’์ด ๋ฐ์ดํ„ฐ๋ฅผ ์–ป์–ด ๋ถˆ๋Ÿ‰์„ ๊ฒ€์‚ฌํ•˜๋Š” ์–ดํ”Œ๋ฆฌ์ผ€์ด์…˜์ž…๋‹ˆ๋‹ค.

<์ถœ์ฒ˜: Stemmer Imaging>

์šฉ์ ‘ ๊ฒ€์‚ฌ(Weld inspection)

์šฉ์ ‘๋ถ€์— ๋ฌธ์ œ๊ฐ€ ์—†๋Š”์ง€ ๊ฒ€์‚ฌํ•˜๋Š” ์–ดํ”Œ๋ฆฌ์ผ€์ด์…˜์ž…๋‹ˆ๋‹ค.

<์ถœ์ฒ˜: SmartRay>

ํƒ€์ด์–ด ๊ฒ€์‚ฌ(Tire inspection)

ํƒ€์ด์–ด ์˜†๋ฉด์˜ ๋ฌธ์ž ์ธ์‹(OCR) ๋˜๋Š” ํƒ€์ด์–ด์˜ ํ™ˆ์„ ๊ฒ€์‚ฌํ•˜๋Š” ์–ดํ”Œ๋ฆฌ์ผ€์ด์…˜์ž…๋‹ˆ๋‹ค.

<์ถœ์ฒ˜: Micro-Elipson>

Pin ๊ฒ€์‚ฌ(Pin inspection)

๊ด‘ ์‚ผ๊ฐ๋ฒ• ์Šค์บ๋„ˆ์˜ ๋Œ€ํ‘œ์ ์ธ ์–ดํ”Œ๋ฆฌ์ผ€์ด์…˜ ์ค‘ ํ•˜๋‚˜์ž…๋‹ˆ๋‹ค. ํ•€์˜ ํœ˜์–ด์ง, ๋†’์ด๋ฅผ ๊ฒ€์‚ฌํ•˜๊ธฐ์— ์ œ๊ฒฉ์ด์ฃ .

<์ถœ์ฒ˜: G2 Technologies>

BGA ๊ฒ€์‚ฌ(Ball grid array inspection)

Ball์˜ ๋†’์ด, ์ด๋ฌผ, ๊ฒฐํ•จ ๋“ฑ์„ ๊ฒ€์‚ฌํ•˜๋Š” ์–ดํ”Œ๋ฆฌ์ผ€์ด์…˜์ž…๋‹ˆ๋‹ค.

<์ถœ์ฒ˜: 3DProfiler>

 

๋ฐ˜์‘ํ˜•

'Machine Vision > 3D' ์นดํ…Œ๊ณ ๋ฆฌ์˜ ๋‹ค๋ฅธ ๊ธ€

[3D] ๊ด‘ ์‚ผ๊ฐ๋ฒ• ๊ตฌ์„ฑ๊ณผ 3D ๋ฐ์ดํ„ฐ  (0) 2019.05.03